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E2 Electronics uses edge and innovative technology with
existing technologies
for meeting the goals of our customer, and provides the
edge needed in
today's market. Technologies are varied upon needs and requirements.
Some of our technologies include:
FR4, FR4 multi function and high TG, BT, Flex and more.
Thick Film Ceramic.
HASL, Ni/Au, Immersion Gold, Entek.
TH, SMT, BGA, Flip Chip, Chip On Board.
Printed Resistors and Resistors networks, Printed coils.
Wire Bond, BGA Balls, Reflow and Wave Soldering.
Drill Via, HDI or Micro Via, Control Impedance.
Multi later stack up, Cross talk, Parallelism.
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